AeroDef will feature dozens of technical sessions, interactive learning opportunities, keynote speakers and panel discussions over the course of three days. Panel discussion topics include cybersecurity vulnerabilities in the aerospace and defense manufacturing supply chain, with a focus on current and emerging solutions. Another panel, and complementary learning opportunities, will explore the current state and transformational potential of 3D technologies like additive manufacturing, 3D printing, modeling and simulation and design engineering.
Keynote addresses and panels, and entry to the exposition floor, are complimentary to attendees who register in advance of AeroDef Manufacturing at www.aerodefevent.com. Keynotes take place in The Deck, a central part of the exposition floor designed to reflect the collaborative nature of AeroDef.
AeroDef is produced in partnership with leading OEMs to bring together the supply chain in order to find integrated solutions to complex manufacturing challenges. Executive committee members include senior manufacturing professionals from Bell Helicopter/Textron, Boeing, EADS, Lockheed Martin, National Center for Defense Manufacturing and Machining, Northrop Grumman and Raytheon.
The exposition floor is arranged by technology zones: composites, metals & advanced materials; contract manufacturing services; digital & additive manufacturing; finishing & coatings: extreme environments & survivability; integrated assembly & robotics; precision machining & tooling; and quality, measurement & inspection.