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Dow Corning Launches High-Performance Thermally Conductive Adhesives

October 9, 2013

Dow Corning recently launched two new thermally conductive adhesives developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. The new silicone technologies include Dow Corning TC-2030 Thermally Conductive Adhesive, the company’s most advanced solution for traditional automotive electronics applications, and Dow Corning TC-2035 Thermally Conductive Adhesive, a high-performance thermal interface material for high-heat automotive applications, such as next-generation power electronic modules.