"At Dow Electronic Materials, sustainability is a core value of how we operate as well as a key driver of how we help our customers succeed," said JR Chen, global business director for Dow Electronic Materials. "The solutions that reduce environmental impact are a testimony to the value we place on sustainable practices. We will continue to innovate with customers to advance the metallization industry in a more sustainable manner to protect people and our planet," he said.
Dow's cyanide-free silver solutions provide robust performance in both decorative and functional applications. SILVERONTM GT-101 Cyanide Free Silver and SILVERONTM GT-820 Cyanide Free Silver Tin offer excellent brightness, adhesion, contact resistance and solder ability, and can be applied to both copper and nickel alloys.
Dow's latest electrolytic tin products offer matte and bright tin solutions for electronic finishing applications. SOLDERONTM ST-300T Matte Tin provides excellent distribution over a wide current density range, and SOLDERONTM BHT-350 Bright Tin, a low carbon deposit, demonstrates high ductility from an electrolyte with high cathode efficiency across a wide operating window.
For applications demanding nickel-free finishes, in response to regulatory requirements, Dow's cyanide-and-lead-free white bronze solutions replace the use of nickel for human and water contact applications. RONALLOYTM GT-250 White Bronze and AQUALLOYTM GT-640 Cyanide Free White Bronze offer mirror-like, bright white and corrosion resistant bronze deposits.
To realize the needs for selective metallization or etching, Dow's LITHOJET 200 Series Ink for inkjet masking offers off contact, digital processing with rapid design change, prototyping, and mass production capability. Compared to conventional masking systems, it can provide higher yields and shorter processes with reduced consumables, waste water and power.