Henkel Patents Hotmelt Adhesive with Improved Adhesion

June 6, 2013

U.S. 8,222,336 B2
Henkel AG and Co. has been granted a patent for a hot melt adhesive consisting of 10%-80% weight of at least one copolymer, based on ethylene and/or propylene and C4 to C20 -olefins, that is obtained by metallocene-catalyzed polymerization; 5%-60% weight of at least one tackifying resin; 0.1%-15% weight of at least one polymerizate based on C2 to C5 olefins and (meth)acrylic acid esters, the polymerizate containing COOH groups or anhydride groups; and 0%-45% weight of additives.

Related Knowledge Center:

blog comments powered by Disqus