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H.B. Fuller Patents Low Application Temperature Hot Melt Adhesive

Published July 19, 2013
U.S. 8,211,521 B2
H.B. Fuller Company has been awarded a patent for a hot melt adhesive composition comprised of a thermoplastic polymer comprised of ethylene copolymer selected from the group consisting of ethylene vinyl acetate, ethylene n-butyl acrylate, ethylene methyl-methacrylate, ethylene ethyl methacrylate, ethylene 2-ethylhexyl acrylate, ethylene methacrylate, ethylene ethylacrylate and ethylene acrylic acid; a first tackifying agent comprised of phenol-modified aromatic petroleum hydrocarbon resin; and a first wax, wherein the composition is free of a vegetable wax and exhibits a viscosity of no greater than approximatley 6,000 centipoise at 300° F.

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