Bostik patents hot melt adhesive

December 19, 2011

Patent No. U.S. 7,838,590 B2
Bostik, Inc. has been granted a patent for a hot melt adhesive composition comprised of a blend of the following components:approximately 1-20% by weight of a styrene-ethylene-ethylene-propylene-styrene random block copolymer; 10-70% by weight of a first midblock tackifying resin having a softening point of 85°-125° C; 0-65% by weight of a second midblock tackifying resin; 5-60% by weight of a plasticizer; and 0-20% by weight of an end block reinforcing resin having a softening point equal to or higher than 115° C; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than 20,000 mPa·s at 160° C.