09.26.16
Lord Corporation has announced the availability of a proven family of fast-curing release agents designed for use with molded elastomers.
Lord LokRelease Mold Release solutions are formulated to increase time between mold-picking and to reduce mold fouling in the rubber-to-substrate molding processes.
“Now commercially available, our mold releases have been used in Lord rubber-to-metal part manufacturing facilities for several years,” says Chris Schneider, Manager, Tech Services, Lord Corporation. “Building on more than 90 years of experience with world-leading in-mold bonding adhesives, Lord LokRelease solutions provide a semi-permanent, anti-stick surface coating for fast, easy part removal from molds.”
Applications for Lord LokRelease Mold Release include industrial rubber-to-substrate molding, automotive rubber-to-substrate molding and other molding processes such as injection, compression and transfer molding.
Advantages of the Lord LokRelease Mold Release solutions include the following:
• Versatility--LokRelease is available in three convenient product forms of aerosol, aqueous and solvent-based solutions.
• Process Enhancer--Provides quick, easy part release and produces low build-up, allowing more production time between mold cleanings.
• Manufacturing Efficiencies--A single application allows for multiple molding cycles.
• Improved Appearance--Reduces defects caused by sticking and is nontransferable, eliminating post-finishing problems.
• Environmentally Recommended--Contains no Class I or Class II ozone-depleting substances; contains no 1, 1, 1, tricholoroethane or methylene chloride. A water-based coating reduces rust and corrosion in steel molds.
Substrates compatible with Lord LokRelease include the following:
• EPDM
• Natural rubber
• Nitrile
• Neoprene
• Epoxy/plastic laminates
• Silicone
• Fluoropolymer
• Plastic
“This family of mold release solutions makes part release from the mold quick and easy,” says Schneider. “Just a single application allows for multiple molding cycles. LokRelease also reduces defects caused by sticking, does not transfer to the elastomer compound and doesn’t interfere with compound chemistry.”
Lord LokRelease Mold Release solutions are formulated to increase time between mold-picking and to reduce mold fouling in the rubber-to-substrate molding processes.
“Now commercially available, our mold releases have been used in Lord rubber-to-metal part manufacturing facilities for several years,” says Chris Schneider, Manager, Tech Services, Lord Corporation. “Building on more than 90 years of experience with world-leading in-mold bonding adhesives, Lord LokRelease solutions provide a semi-permanent, anti-stick surface coating for fast, easy part removal from molds.”
Applications for Lord LokRelease Mold Release include industrial rubber-to-substrate molding, automotive rubber-to-substrate molding and other molding processes such as injection, compression and transfer molding.
Advantages of the Lord LokRelease Mold Release solutions include the following:
• Versatility--LokRelease is available in three convenient product forms of aerosol, aqueous and solvent-based solutions.
• Process Enhancer--Provides quick, easy part release and produces low build-up, allowing more production time between mold cleanings.
• Manufacturing Efficiencies--A single application allows for multiple molding cycles.
• Improved Appearance--Reduces defects caused by sticking and is nontransferable, eliminating post-finishing problems.
• Environmentally Recommended--Contains no Class I or Class II ozone-depleting substances; contains no 1, 1, 1, tricholoroethane or methylene chloride. A water-based coating reduces rust and corrosion in steel molds.
Substrates compatible with Lord LokRelease include the following:
• EPDM
• Natural rubber
• Nitrile
• Neoprene
• Epoxy/plastic laminates
• Silicone
• Fluoropolymer
• Plastic
“This family of mold release solutions makes part release from the mold quick and easy,” says Schneider. “Just a single application allows for multiple molding cycles. LokRelease also reduces defects caused by sticking, does not transfer to the elastomer compound and doesn’t interfere with compound chemistry.”