Patent No. U.S. 7,645,831 B2
Henkel AG & Co. has obtained a patent for a moisture curable hot melt adhesive composition prepared by reacting a polyisocyanate with a mixture comprised of a urethane diol and a polyether polyol or polyester diol or both. The urethane diol being the reaction product of a cyclic carbonate and a compound containing an amino group and a further group selected from the group consisting of amino groups and hydroxyl groups, which composition, in the presence of moisture, cures to an irreversible solid form.
Henkel Patents Reactive Hot Melt Adhesives
Published April 6, 2010
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