Recognized for its ease of use and cost-effectiveness with die attach processes for leadframe packages, Henkel has extended its Wafer Backside Coating (WBC) portfolio to also include a solution for stacked die packages. Ablestik WBC-8901UV has been designed to address the demanding requirements of multiple die stack applications for the memory market segment, including packages such as TSOPs, MCPs and FMCs (Flash Memory Cards). The unique formulation of Ablestik WBC-8901UV offers a robust and cost-effective alternative to current film-based solutions for die stacking processes, reducing the total cost of ownership as compared to film by as much as 30% to 50%. Process flexibility is also enhanced, as packaging specialists can now adjust die attach thickness based on specific manufacturing requirements and can also select their dicing tape of choice. Film die attach materials are generally supplied in predetermined thicknesses as a bundled product which incorporates the dicing tape. Applied via a spray coating method following the wafer thinning process, Ablestik WBC-8901UV is precisely deposited across the back of the silicon wafer following which the material is B-staged using a UV irradiation process. After this step, dicing tape is laminated to the wafer, backgrinding tape is removed and the wafer is diced in preparation for die pick-up and placement. Henkel is currently partnering with spray technology and backgrinding equipment manufacturers to deliver an integrated, inline process solution for this unique WBC advance.
Henkel Develops Ablestik WBC-8901UV
Published October 5, 2010
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