U.S. 8,101,043 B2
Dow Global Technologies LLC has obtained a patent for a method for bonding a transparent substrate within an opening of a structure comprised of the steps of applying to a transparent substrate a primer composition that includes a colorant and at least one isocyanate functional prepolymer derived from the reaction of an aliphatic polyisocyanate and a polyether polyol, wherein the prepolymer is at least partially reacted with the active hydrogen of an organofunctional silane; applying an adhesive to the structure defining the opening or to the primer composition on the transparent substrate; and installing the transparent substrate within the opening, wherein the resulting installed substrate is free of any ceramic enamel.