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Henkel patents room temperature curing adhesive

Published June 5, 2012
U.S. 8,119,754
Henkel Corporation has obtained a patent for room temperature cure adhesive composition comprised of at least one polyurethane oligomer having (meth)acrylate functionality present in an amount of from approximately 25% to 30% by weight of the total composition; a reactive monomer comprised of cycloalkyl(meth)acrylate present in an amount of 10% to 50% by weight of the total composition; at least one maleimide-functionalized compound present in an amount of from 15% to 30% by weight of the total composition; and a cure system comprised of at least one free-radical initiator.

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