The Engent business adds state-of-the-art development capabilities, testing resources and technical support infrastructure. As a global, adhesives solutions provider in the electronics market, H.B. Fuller has now increased its market knowledge and qualification capabilities in a wide range of microelectronic assembly technologies. The company will combine and leverage the adhesive development capabilities, investment resources and global reach of H.B. Fuller with the electronics expertise of Engent.
Engent is a provider of next generation microelectronics development, testing and manufacturing services. Located in Norcross, Ga., Engent was founded in 2003 to provide niche production, development and qualification services for small form factor (SFF) electronics. Engent engages in all stages of the electronic miniaturization process and serves key microelectronic markets in the military, medical and industrial sectors with clients ranging from entrepreneurial technology firms to Fortune 50 companies.
The Engent business generated under $10 million in revenue in 2011 at margins above H.B. Fuller's current levels. The results of this business will be included in the company's North America Adhesives business segment going forward.