BYK-P 9085 processing additive provides mold release and surface enhancing
Published June 5, 2012
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BYK-P 9085 was developed for Low Profile and Class A SMC systems. It stabilizes the compound and improves flow behavior. Because of its mold-release properties, BYK-P 9085 replaces the traditional mold-release products the company said. BYK-P 9085 improves the surface quality of the molded part. It also improves the paint adhesion and the bondability of the molded parts. BYK-P 9085 affects thickening. An additional 10 percent MgO may be needed to achieve thickening properties comparable to the Zn/Ca stearate system.
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