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Allnex to Highlight UV/EB Curable Coating Resins at RadTech Europe

September 27, 2013

Allnex will be exhibiting at RadTech Europe 13 at booth No. 14. Allnex will present its broad range of UV/EB Curable Coating Resins. RadTech Europe13 Conference and Exhibition will take place at the Congress Center Basel on 15-17 October 2013 in Basel Switzerland.

As one of the pioneers of energy cured coating technology, Allnex has both extensive expertise and a comprehensive portfolio of products and capabilities that enables us to help customers find the most effective solutions to their UV/EB coating and ink challenges.

Visitors can meet their experts for 100% solids and waterborne urethane acrylates. They can also learn about Low Extractable and Odor (LEO) resins specifically formulated for use in low odor, low migration inks and coatings applied to food packaging.

In addition, attendees to the RadTech Europe 13 Conference will have the opportunity to learn about some of the most recent advances in UV curable resin technology from Allnex.

Dr. Philippe De Groote, Technical Service & Development, will present a paper on the latest developments in energy curable resins for hardcoat applications on 15 October 2013, Session 3, at 2:20 pm. This session will highlight new tin-free UV resins from Allnex delivering enhanced abrasion resistance compared to traditional hexafunctional urethane acryalates. Those resins are recommended for the formulation of hardcoats on consumer goods as well as in industrial plastic applications, especially at low coat weight and/or under low curing energy conditions.

On the following day (16 October 2013) at 2:25 pm as part of Session 7, Paul Geveart, Technical Service & Development, will discuss a new self-curing acrylate resin for UV inks and coatings used in indirect consumer product packaging applications. This new polymeric resin generates free radicals upon UV irradiation and does not produce any unwanted byproducts. In addition, acrylate functionalities incorporated in the oligomer react when the resin is cured, binding the resin into the matrix of the film, thus further reducing the risk of migration, which is an increasing issue for low molecular weight photoinitiators.