Adhesive compositions for

March 19, 2007

Patent No. U.S. 7,115,676 B2
Henkel has received a patent for an adhesive composition capable of bonding passive substrates. It comprises at least one monomer; at least one peroxy free radical initiator; at least one onium salt; and at least one organic hydrazine present in an amount less than one percent by weight of the composition, wherein the monomer is selected from the group consisting of styrene, thiol-enes, acrylamides, maleate esters, fumarates, methylene maleates and epoxides.

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