Patents

Henkel patents multi-stage curing adhesive

November 14, 2008

Patent No. U.S. 7,311,973 B2
Henkel has been granted a patent for a flexible laminate comprised of a first substrate consisting of plastic film; a second substrate selected from the group consisting of plastic film and metal foil; and an irradiated adhesive composition positioned between the first and second substrate, the adhesive composition is comprised of components A, B and D. Component A being at least one polymer having a molecular weight (Mn) of at least 800 that has at least one functional group polymerizable by irradiation with ultraviolet (UV) light or with electron beams and has at least one functional group selected from the group consisting of isocyanate groups and epoxy groups; capable of reacting with a compound having at least one acidic hydrogen atom, component B being at least one compound having a molecular weight (Mn) of 100-8000 which has at least two functional groups polymerizable by irradiation with UV light or with electron beams; and component D being a compound having at least two acidic hydrogen atoms, wherein component A, component B and component D are each a different compound.