Hempel Introduces Hempatherm IC, Its First Thermal Insulation Coatings System

As the need to control maintenance costs and manage Corrosion Under Insulation (CUI) increases, Hempel A/S introduces Hempatherm IC. The seamless coatings system, with one of the market’s highest film build capabilities, offers superior protection and mitigation of CUI by significantly reducing the risk of water ingress and retention.

Made up of Hempatherm IC 170 and Hempatherm IC 175, the system is designed to replace many conventional insulation systems in the critical CUI temperature range. It provides both thermal insulation and mitigation of CUI, thereby maximising the service life of industrial equipment and assets.

“Process industry operators are constantly looking for solutions that reduce the risk of CUI, while managing their personnel safety and energy consumption in a responsible way. They want robust solutions to minimise disruption and deliver long-term value,” said Zechariah Lim, product manager CUI/High Heat & Insulation at Hempel.

“The Hempatherm IC system offers just that,” Lim added. “It is designed with our customers’ need for energy conservation in mind, without the risk of associated CUI. Coatings provide a simple and elegant alternative to meet this requirement, while promoting cost competitiveness, produc-tivity, and sustainability over its service life for all stakeholders across the value chain.”

“Hempel is excited to be part of the market shift from mechanical insulation to an advanced insu-lation coatings system,” David Hunter, segment development manager, CUI/High Heat & Insulation at Hempel. “Insulation coatings have over 25 years of proven performance, but up until now, limitations on coating film thickness have limited thermal insulation coatings as a comparative alternative. Our Hempatherm system provides one of the market’s highest film builds per coat, with a material engineered to maintain thermal performance over the service life, often in the range of 15-25 years.”

Hempatherm IC prevents water ingress and retention on insulated equipment, thereby eliminating the risk of CUI. Aerogel filler provides low thermal conductivity, capable of replacing many types of conventional mechanical insulation within the critical CUI temperature range, from – 25°C up to 177°C (350°F). The non-flammable formulation allows for safe application on hot surfaces for quick maintenance to ensure assets are kept in service with minimal disruption to operations.