11.10.16
Dow and Dow Corning are presenting their latest innovative technologies and breakthroughs for the pharmaceutical industry here at the American Association of Pharmaceutical Scientists (AAPS) Annual Meeting and Exposition, Nov. 13-16, 2016. This year’s event marks the first joint appearance at AAPS by the Dow and Dow Corning teams since Dow became 100 percent owner of Dow Corning’s silicones business on June 1, 2016.
Dow Corning is introducing Dow Corning® SilAc Hybrid Pressure Sensitive Adhesives (PSAs) for transdermal therapy systems, which effectively combine the leading properties of acrylic and silicone polymers in a versatile adhesive family for patch development. Dow Corning is also showcasing a unique and innovative range of silicone-based topical ingredients that can be used in many different forms to manage acne. With their enhanced spreading capabilities, sensory properties and long-lasting effects, these ingredients can help customers create novel formulations for acne management.
“Transdermal and topical drug delivery systems must ensure proper drug loading, stability and release,” said Gary Lord, global strategic marketing director, healthcare, Dow Corning. “Dow Corning supports evolving industry requirements by continuing to expand our silicone-based solutions for drug delivery and consumer healthcare applications. We have enhanced our BIO-PSA family with a single-technology hybrid solution that addresses multiple needs for patch formulators and pharmaceutical companies. Also, we are offering formulators new concepts for the growing market in OTC acne management. Through innovation and collaboration, Dow Corning is helping the industry achieve its current and future goals.”
Dow Pharma Solutions is highlighting its latest innovations for solubility enhancement and productivity enhancement, including: AFFINISOL™ HPMC HME, a new grade of hydroxypropyl methycellulose with improved thermal properties designed to solve the insoluble through hot melt extrusion without plasticizers; AFFINISOL™ hypromellose acetate succinate (HPMCAS), designed for solubility enhancement and available in standard and custom quality by design options to best match the needs of the active pharmaceutical ingredient (API); ETHOCEL™ High Productivity polymers for high-speed dry powder layering processes, which coat up to 70 percent faster than current multi-particulate coating technologies without the use of solvents; and METHOCEL™ DC2 for dry powder processing techniques, which help shorten development time and can reduce manufacturing costs by up to 60 percent.
Dow and Dow Corning already have a solid platform to build on: 73 years of shared history, shared values, and the same passion for innovation and customer focus. Dow Corning's silicones business reinforces Dow Pharma Solutions’ offering for topical, transdermal applications, as well as in transdermal, topical and oral gastroenterology. The relationship also enables Dow to provide complementary technology offerings in attractive industry segments, such as medical devices, where Dow Corning is already a leader.
“Separately, Dow and Dow Corning were experts in drug delivery, but coming together truly deepens, broadens and strengthens our expertise,” said Dago Caceres, global marketing leader for Dow Pharma Solutions. “Strong synergies between our two organizations provide access to expanded resources, services and technologies, including additional research and development capabilities.” Together, the Dow and Dow Corning teams’ expanded portfolio offerings now include tablets, capsules, liquids, semi-liquids, and topical and transdermal applications, and process technologies for hot melt extrusion, spray-dry dispersion, direct compression and bioprocessing.
The Dow and Dow Corning teams are presenting research posters on the following topics, and are available to answer questions:
Dow Corning is introducing Dow Corning® SilAc Hybrid Pressure Sensitive Adhesives (PSAs) for transdermal therapy systems, which effectively combine the leading properties of acrylic and silicone polymers in a versatile adhesive family for patch development. Dow Corning is also showcasing a unique and innovative range of silicone-based topical ingredients that can be used in many different forms to manage acne. With their enhanced spreading capabilities, sensory properties and long-lasting effects, these ingredients can help customers create novel formulations for acne management.
“Transdermal and topical drug delivery systems must ensure proper drug loading, stability and release,” said Gary Lord, global strategic marketing director, healthcare, Dow Corning. “Dow Corning supports evolving industry requirements by continuing to expand our silicone-based solutions for drug delivery and consumer healthcare applications. We have enhanced our BIO-PSA family with a single-technology hybrid solution that addresses multiple needs for patch formulators and pharmaceutical companies. Also, we are offering formulators new concepts for the growing market in OTC acne management. Through innovation and collaboration, Dow Corning is helping the industry achieve its current and future goals.”
Dow Pharma Solutions is highlighting its latest innovations for solubility enhancement and productivity enhancement, including: AFFINISOL™ HPMC HME, a new grade of hydroxypropyl methycellulose with improved thermal properties designed to solve the insoluble through hot melt extrusion without plasticizers; AFFINISOL™ hypromellose acetate succinate (HPMCAS), designed for solubility enhancement and available in standard and custom quality by design options to best match the needs of the active pharmaceutical ingredient (API); ETHOCEL™ High Productivity polymers for high-speed dry powder layering processes, which coat up to 70 percent faster than current multi-particulate coating technologies without the use of solvents; and METHOCEL™ DC2 for dry powder processing techniques, which help shorten development time and can reduce manufacturing costs by up to 60 percent.
Dow and Dow Corning already have a solid platform to build on: 73 years of shared history, shared values, and the same passion for innovation and customer focus. Dow Corning's silicones business reinforces Dow Pharma Solutions’ offering for topical, transdermal applications, as well as in transdermal, topical and oral gastroenterology. The relationship also enables Dow to provide complementary technology offerings in attractive industry segments, such as medical devices, where Dow Corning is already a leader.
“Separately, Dow and Dow Corning were experts in drug delivery, but coming together truly deepens, broadens and strengthens our expertise,” said Dago Caceres, global marketing leader for Dow Pharma Solutions. “Strong synergies between our two organizations provide access to expanded resources, services and technologies, including additional research and development capabilities.” Together, the Dow and Dow Corning teams’ expanded portfolio offerings now include tablets, capsules, liquids, semi-liquids, and topical and transdermal applications, and process technologies for hot melt extrusion, spray-dry dispersion, direct compression and bioprocessing.
The Dow and Dow Corning teams are presenting research posters on the following topics, and are available to answer questions:
- “Defining Formulation Best Practices for a Direct Compression Grade of Hydroxypropyl Methylcellulose” on Monday, Nov. 14 at 12:00 p.m. in Terminal 31
- “Evaluation of AFFINISOL™ Polymer by Top Spray Granulation Technology to Increase the Solubility of Class II Drug” on Monday, Nov. 14 at 3:00 p.m. in Terminal 32
- “Prediction of Tablet Dissolution from API and Poly(Ethylene Oxide) Properties” on Tuesday, Nov. 15 at 12:00 p.m. in Terminal 32
- “Defining Formulation Best Practices for a Direct Compression Grade of Hydroxypropyl Methylcellulose” on Tuesday, Nov. 15 at 12:00 p.m. in Terminal 29
- “Formulation Performance and Stability of Hydroxypropyl Methylcellulose Acetate Succinate Designed for Hot Melt Extrusion” on Thursday, Nov. 17 at 11:00 a.m. in Terminal 34
- “Melt Rheology of Cellulose Ethers Designed for Hot Melt Extrusion via In-Line Rheological Analysis” on Thursday, Nov. 17 at 12:00 p.m. in Terminal 27
