05.04.18
Sartomer Americas, a business unit of Arkema Inc., will feature specialty adhesion promoting oligomers that answer food packaging challenges at the RadTech UV+EB 2018 Technology Expo and Conference at booth 501.
Sartomer's CN827 and CN828 are adhesion promoting oligomers developed to meet indirect food packaging regulatory requirements. These oligomers successfully promote adhesion to difficult substrates used in flexible food packaging. And both products offer excellent cure response with both UV and LED systems.
CN827, a unique acrylic oligomer that meets all food packaging requirements and imparts flexibility, hardness, and chemical resistance. It promotes adhesion to non-porous substrates, especially plastics, and is ideal for flexo, inkjet, and litho applications.
CN828 is a new high-purity polyester acrylate specifically developed to provide enhanced adhesion on to a wide variety of plastic substrates. It is fully compliant with all current indirect food packaging regulations, including Swiss Ordinance, Nestlé Guidance Notes on Packaging Inks, and EuPIA regulatory guidelines, with no risk of contamination and a very low potential for migration. It is ideal for overprint varnish and ink applications.
RadTech attendees can learn more about adhesive technology for food packaging at this presentation:
Sartomer's CN827 and CN828 are adhesion promoting oligomers developed to meet indirect food packaging regulatory requirements. These oligomers successfully promote adhesion to difficult substrates used in flexible food packaging. And both products offer excellent cure response with both UV and LED systems.
CN827, a unique acrylic oligomer that meets all food packaging requirements and imparts flexibility, hardness, and chemical resistance. It promotes adhesion to non-porous substrates, especially plastics, and is ideal for flexo, inkjet, and litho applications.
CN828 is a new high-purity polyester acrylate specifically developed to provide enhanced adhesion on to a wide variety of plastic substrates. It is fully compliant with all current indirect food packaging regulations, including Swiss Ordinance, Nestlé Guidance Notes on Packaging Inks, and EuPIA regulatory guidelines, with no risk of contamination and a very low potential for migration. It is ideal for overprint varnish and ink applications.
RadTech attendees can learn more about adhesive technology for food packaging at this presentation:
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"New Adhesion Promoting Oligomers for Indirect Food Packaging" by Anna Johnson
Monday, May 7, 8:00-10:00 a.m., Track A, Adhesion Promotion/Adhesives
