Recently there has been a strong regulatory push to incentivize use of environmentally-friendly products, which in combination with an increased environmental consciousness among the public has put pressure on adhesive using manufacturers to opt for HMA, which has no VOC emissions, over alternate solvent-based adhesives. While HMA has key applications to textile, packaging, furniture, and hygiene products industries, GCiS forecasts electronics will continue to have the highest growth, where hot melts are used for the manufacturing and assembly, of electronic components, chips and boards, cell phones, and computers. In total, these end-user industries are reported to have consumed over 400,000 metric tons of HMA in China currently.
Despite the overall economic slowdown, which will impact many downstream industries, suppliers are generally optimistic about demand for hot melt adhesives in the coming years. Multinational suppliers hold a very dominant position in the market, especially in industries that demand reliable high quality adhesive products. Both domestic and foreign suppliers are prepared to introduce products suitable for specific applications, temperature and bonding requirements.
This GCiS market study draws on a three month in-depth primary survey of 82 of the market’s suppliers, channel players and experts. The report features in-depth analysis of the 7 key hot melt adhesive products, EVA, SBS/SIS, PA, TPU, PUR, and PES hot melts. Major areas for each product segment covered include: market size and shares, five-year projections, market structure, pricing trends, distribution, an assessment of key suppliers and more. Recent developments to product technology, the dynamics of end-user demands, and application trends, are all addressed and thoroughly examined.